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Browse Prior Art Database

Conductive Pastes

IP.com Disclosure Number: IPCOM000089857D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Feeley, JD: AUTHOR [+3]

Abstract

These are conductive pastes for deposition of electrode patterns and the like on substrates such as electronic modules. They can be dip-soldered at temperatures below the decomposition points of the vehicles.

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This is the abbreviated version, containing approximately 96% of the total text.

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Conductive Pastes

These are conductive pastes for deposition of electrode patterns and the like on substrates such as electronic modules. They can be dip-soldered at temperatures below the decomposition points of the vehicles.

The pastes are comprised of metal powders in vehicles. The powders can be copper, silver, tin, lead, gold, alloys of these, etc.

The vehicles are comprised of the reaction product of the anhydride of a tricarboxylic acid with an aromatic diamine. This reaction product is dissolved in and is completely miscible with a high-viscosity polar solvent having a boiling point lying between 230 degrees and 330 degrees C. Optionally, for higher viscosity and improved flow control, the solvent can also contain an alcohol having a boiling point of at least 230 degrees C but not over 300 degrees C.

The vehicle ingredients are mixed at an elevated temperature, such as 80 degrees C, cooled to room temperature, and then combined with the metal powders in a roller mill to form a smooth, wetted-out paste.

Some specific examples are:
1) 3.3 g of the reaction product of trimellitic anhydride

and p-phenylenediamine. The latter is available as

AI-10 from Amoco Chemicals Corp.

63 g diethanolamine

33 g 2-naphthol

100 g copper powder, 400 mesh
2) 2.25 g of AI-10

37.7 g diethanolamine

100 g copper powder, less than 1 micron particle size.

The electrical resistivity of screen-printed lines 10 mils wide, made with these pastes after electroless nickel plating and dip...