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Solder Flux having Reduced Void Forming Properties

IP.com Disclosure Number: IPCOM000089858D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Herbst, A: AUTHOR

Abstract

In soldering the backside of semiconductive chips to substrates, a problem is the formation of voids in the solder joints. The voids are generated by CO(2) formation during the soldering operation, due to decarboxylation of abictic and pimaric acids, major components of the water white rosin flux used. By replacing the rosin with methoxypolyethylene glycol monostearate, average M.W. about 630, the number of voids is markedly reduced. The good qualities of water white rosin are retained.

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Solder Flux having Reduced Void Forming Properties

In soldering the backside of semiconductive chips to substrates, a problem is the formation of voids in the solder joints.

The voids are generated by CO(2) formation during the soldering operation, due to decarboxylation of abictic and pimaric acids, major components of the water white rosin flux used. By replacing the rosin with methoxypolyethylene glycol monostearate, average M.W. about 630, the number of voids is markedly reduced. The good qualities of water white rosin are retained.

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