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Printing a Wiring Pattern

IP.com Disclosure Number: IPCOM000089861D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Wager, AJ: AUTHOR [+2]

Abstract

This method is for printing an electrically conducting circuit on a ceramic surface by using a mask that does not contain the desired circuit pattern.

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Printing a Wiring Pattern

This method is for printing an electrically conducting circuit on a ceramic surface by using a mask that does not contain the desired circuit pattern.

The desired circuit pattern and through-holes are first etched into ceramic surface 20. Then the mask is placed over it and has metallic paste squeezed through it. Engraved channels 22 in 20 are filled with the conductive paste, forming the desired printed circuit. Via connection pads 24 are centered over the vias. Perforations in the mask which cover unetched areas of 20 leave discontinuous prints 26. Connections 28 between channels 22 and the vias are formed as channels 22 by etching of 20 prior to printing with the metallic paste.

If high-metal content paste is not needed for via filling, they can be filled in the same printing as the printed circuit pattern. In this case, the printed circuit pattern, consisting of channels 22, connections 28 and the vias, are printed in one screening. This method is useful in any printing process where channels can be engraved in the surface to be printed and ink can flow into these embossed channels through a mask.

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