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Pin Utilization on Multilayer Ceramics

IP.com Disclosure Number: IPCOM000089862D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Ruddell, RL: AUTHOR [+2]

Abstract

This method is for making contact to pins in ceramic modules. Initially, pins 10 are mechanically pinned into translate layer 20. Multilayer ceramic 30, having through-holes, is glassed to layer 20 by glass layer 40. The through-holes in ceramic 30 are placed concentrically with the recesses in layer 20, thus forming cavity 50. The diameter of a recess in layer 20 is larger than that of a through-hole in ceramic 30. After glassing the parts together, a cavity 50 is filled with silver palladium powder 52 and sintered. The next step is dip-soldering, resulting in structure 54, the solder filling the entire cavity 50, wetting pins 10, and therefore making good electrical as well as mechanical contact.

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Pin Utilization on Multilayer Ceramics

This method is for making contact to pins in ceramic modules. Initially, pins 10 are mechanically pinned into translate layer 20. Multilayer ceramic 30, having through-holes, is glassed to layer 20 by glass layer 40. The through-holes in ceramic 30 are placed concentrically with the recesses in layer 20, thus forming cavity 50. The diameter of a recess in layer 20 is larger than that of a through- hole in ceramic 30. After glassing the parts together, a cavity 50 is filled with silver palladium powder 52 and sintered. The next step is dip-soldering, resulting in structure 54, the solder filling the entire cavity 50, wetting pins 10, and therefore making good electrical as well as mechanical contact.

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