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Printed Circuit Substrates

IP.com Disclosure Number: IPCOM000089868D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Daniels, RS: AUTHOR

Abstract

Substrate structures for printed circuit device fabrication are formed with high-density patterns of filled holes between surfaces at predetermined microcoordinate positions. The holes are filled with material of a desired conductivity. Such material is for optional use as either elements of electrical circuits or as physical extensions of the main insulative body of the substrate in further processing of the substrate into a complete printed circuit device.

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Printed Circuit Substrates

Substrate structures for printed circuit device fabrication are formed with high-density patterns of filled holes between surfaces at predetermined microcoordinate positions. The holes are filled with material of a desired conductivity. Such material is for optional use as either elements of electrical circuits or as physical extensions of the main insulative body of the substrate in further processing of the substrate into a complete printed circuit device.

In drawing A, the substrates are made by stringing very thin conductive wires 1, e.g., copper, beryllium copper, etc., through closely spaced holes 2, in end plates 3 of molding fixture 4. A slight clearance between holes 2 and ends 5 of wires 1 permits fine adjustments of the wire positions by devices, not shown, attached to ends 5. Wire diameters and hole spacings on the order of .002 inches are realized. Unused coordinate holes 6 are sealed, as with wax. The material, glass, ceramic plastic, etc., which forms the main insulative body of the substrates is introduced into the mold fixture in liquid state.

Upon removal from the mold, the cured block encapsulating the wires 1, drawing B, is sliced transversely through the wires into substrate sheets or sections 7 of any desired thickness t. A microtome or other suitable cutting device is used. Filled holes 8 in each section are used optionally as intersurface through-connections. Such holes are also used as inert physical extensions...