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Joining Dip Modules to Printed Circuit Cards

IP.com Disclosure Number: IPCOM000089883D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Morgan, RT: AUTHOR [+2]

Abstract

A dual in-line package DIP generally consists of a series of semiconductor components encapsulated within a solid body, and having protruding electrical contact leads extending beyond the solid body for exterior connections. It is common to join such leads of a DIP to a printed circuit card via some connecting devices.

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Joining Dip Modules to Printed Circuit Cards

A dual in-line package DIP generally consists of a series of semiconductor components encapsulated within a solid body, and having protruding electrical contact leads extending beyond the solid body for exterior connections. It is common to join such leads of a DIP to a printed circuit card via some connecting devices.

DIP module 10, drawing A, having a series of protruding contacts 11, is shown being inserted into guide block 12 for connection with protruding electrical pins such as 13. Block 12 is seated upon pins 13. Block 12, which can be made of plastic for example. It has a series of grooves 14 and is located over protruding pins 13. These protrude from the surface of printed circuit card 15. Block 12 is placed flush with the surface of card 15.

Block 12 acts as a retainer, preventing pins 13 from moving away because of contact force. Movement of pins 13 might break solder joints between pins 13 and card 15.

Module 10 is inserted into block 12 to make contact with protruding pins 13 in any of three modes. In one mode, drawing B, module 10 has pins 11 contacting circuit board pins 13. These protrude from both sides of card 15. Block 12 serves to maintain pressure between the lead 11 and pin 13. After connection is made, connection can be maintained as a pressure connection only, or epoxy or other adhesives can be introduced into the block 12 area for permanent adhesion. Alternatively, as in drawing C, leads 11 of...