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Improving Adhesion of Molybdenum Films

IP.com Disclosure Number: IPCOM000089887D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kaplan, LH: AUTHOR

Abstract

Adherent molybdenum films are deposited on SiO(2) coated substrates at low temperatures. The substrate is coated with a thin film of tungsten, about 100 angstroms thick. Tungsten carbonyl is decomposed on a substrate which is heated at a temperature of between 300-500 degrees C to cause metallic tungsten to deposit on it. Molybdenum carbonyl is subsequently decomposed in a similar manner to cause metallic molybdenum to deposit and adhere strongly to the tungsten film.

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Improving Adhesion of Molybdenum Films

Adherent molybdenum films are deposited on SiO(2) coated substrates at low temperatures. The substrate is coated with a thin film of tungsten, about 100 angstroms thick. Tungsten carbonyl is decomposed on a substrate which is heated at a temperature of between 300-500 degrees C to cause metallic tungsten to deposit on it. Molybdenum carbonyl is subsequently decomposed in a similar manner to cause metallic molybdenum to deposit and adhere strongly to the tungsten film.

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