Browse Prior Art Database

Two Chamber Air To Vacuum Lock System

IP.com Disclosure Number: IPCOM000089896D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Barber, GF: AUTHOR

Abstract

A double-chamber system for introducing substrates into an in-line vacuum evaporation processor prevents contamination of the process chambers. This in-line vacuum evaporation processor consists of first entrance chamber 10, second entrance chamber 12, processing chambers 14 and 16, first exit chamber 18, and second exit chamber 20. The processor is provided with entrance lock 22, interlocks 24, 26, 28, 30, 32, and exit lock 34.

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Two Chamber Air To Vacuum Lock System

A double-chamber system for introducing substrates into an in-line vacuum evaporation processor prevents contamination of the process chambers. This in- line vacuum evaporation processor consists of first entrance chamber 10, second entrance chamber 12, processing chambers 14 and 16, first exit chamber 18, and second exit chamber 20. The processor is provided with entrance lock 22, interlocks 24, 26, 28, 30, 32, and exit lock 34.

In operation, substrate sleds 36, carrying a substrate or substrates on which deposition is to take place, are fed through entrance lock 22 into chamber 10. During this operation, interlock 24 is closed. An inert gas is fed through valve 38 to chamber 10 during the feeding operation, preferably at a pressure somewhat greater than atmospheric. When lock 22 is opened to insert sled 36, outward flow of inert gas occurs and inward flow of air is prevented.

With a sled 36 in chamber 10, lock 22 and valve 38 are closed. Chamber 10 is evacuated by vacuum pump 40 until its pressure is reduced to the level maintained at all times in chamber 12 by its vacuum pump 40. When the pressure is so equalized, interlock 24 is opened, drive rollers 42 are activated to advance sled 36 along support rollers 44 through interlock 24 and into chamber 12. In this chamber the substrates are heated for outgassing and to bring them to a temperature suitable for deposition of films by vacuum evaporation on them. When the heating operation is completed, interlock 26 is opened, the substrate is advanced to chamber 14 by rollers 42 and 44 as previously.

In cha...