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Browse Prior Art Database

Extending Photoresist Life

IP.com Disclosure Number: IPCOM000089912D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR

Abstract

The useful life of a photoresist is extended by applying a negative electrical potential to a printed circuit board during the application of photoresist on such board by dip coating. An electrical potential is applied to the copper clad printed circuit board by connecting the board to the negative terminal of a dry cell via a conducting lead. A platinum wire electrode is immersed in the photoresist and is attached to the positive terminal of the dry cell. The copper concentration in the photoresist is monitored photometrically at an absorbance of 655 nm. The amount of the copper dissolved in the photoresist increases at a much slower rate in the presence of the applied potential than when such potential is not applied.

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Extending Photoresist Life

The useful life of a photoresist is extended by applying a negative electrical potential to a printed circuit board during the application of photoresist on such board by dip coating. An electrical potential is applied to the copper clad printed circuit board by connecting the board to the negative terminal of a dry cell via a conducting lead. A platinum wire electrode is immersed in the photoresist and is attached to the positive terminal of the dry cell.

The copper concentration in the photoresist is monitored photometrically at an absorbance of 655 nm. The amount of the copper dissolved in the photoresist increases at a much slower rate in the presence of the applied potential than when such potential is not applied.

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