Browse Prior Art Database

Cooling System

IP.com Disclosure Number: IPCOM000089944D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Seely, JH: AUTHOR

Abstract

In this vaporization cooling system, the condensing capability is proportionally modulated as a function of the heat being generated. Electronic components 12 to be cooled are immersed in a container 14 of liquid 16 which has a low boiling point such as one of the FREONS* or fluorocarbon. As components 12 consume power, heat is generated which causes nucleate boiling bubbles to form, which because of their lighter density rise toward the top of the container. Thermoelectric condenser 18 is at the top of container 14 within the liquid. The bubbles condense when they contact the finned colder surfaces 20 of condenser 18. The current supplied to condenser 18 by power supply 22 is modulated in accordance with the current provided to components 12 by power supply 24.

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Cooling System

In this vaporization cooling system, the condensing capability is proportionally modulated as a function of the heat being generated. Electronic components 12 to be cooled are immersed in a container 14 of liquid 16 which has a low boiling point such as one of the FREONS* or fluorocarbon. As components 12 consume power, heat is generated which causes nucleate boiling bubbles to form, which because of their lighter density rise toward the top of the container. Thermoelectric condenser 18 is at the top of container 14 within the liquid. The bubbles condense when they contact the finned colder surfaces 20 of condenser 18. The current supplied to condenser 18 by power supply 22 is modulated in accordance with the current provided to components 12 by power supply 24. Since the amount of heat generated by components 12 is proportional to the amount of current supplied, condenser 18 is controlled in accordance with the amount of heat generated. Condenser 18 consists of positive and negative type semiconductor materials 25 and 26, such as bismuth telluride, which are mounted on opposite ends of fins 20, serving the dual purpose of electrical conductors and condensing surfaces. The electrical polarity of the assembly is such that the electron flow is from the positive to the negative semiconductor pellet. The fin surfaces are cold junctions and the two outer surfaces 28 and 30 are hot junctions, in accordance with the Peltier heat pump. The hot junctions ar...