Browse Prior Art Database

Cooling Assembly

IP.com Disclosure Number: IPCOM000089946D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Seely, JH: AUTHOR

Abstract

Semiconductor power devices are usually mounted on heat sinks where the initial heat transfer is obtained by conduction. Subsequent heat transfer is accomplished by natural or forced convection modes, where the coolant is a liquid or a gas. The volumetric ratio of heat sink to device is extremely high, so that a space problem is introduced when a significant number of components are packaged. The arrangement shown conducts the heat to a dielectric liquid, such as one of the fluorochemicals, which pass through a vaporization and condensation cycle to remove the heat from the liquid. The condensation is caused by thermoelectric condenser device 18. Semiconductor device 12 is mounted on a plate portion of heat sink 14 by a heat transfer grease. The heat is transferred from device 12 through plate 14 by conduction.

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Cooling Assembly

Semiconductor power devices are usually mounted on heat sinks where the initial heat transfer is obtained by conduction. Subsequent heat transfer is accomplished by natural or forced convection modes, where the coolant is a liquid or a gas. The volumetric ratio of heat sink to device is extremely high, so that a space problem is introduced when a significant number of components are packaged. The arrangement shown conducts the heat to a dielectric liquid, such as one of the fluorochemicals, which pass through a vaporization and condensation cycle to remove the heat from the liquid. The condensation is caused by thermoelectric condenser device 18. Semiconductor device 12 is mounted on a plate portion of heat sink 14 by a heat transfer grease. The heat is transferred from device 12 through plate 14 by conduction. Plate 14 is arranged to contain tubular chamber 16 which is filled with the fluorochemical liquid. The heat transferred to the liquid causes vaporization within chamber 16. The vaporized dielectric flows towards device 18, where it condenses on cold junctions 20. The condensing rate is controlled by modulating the current to device 18. This modulation is in accordance with the principle of the Peltier heat pump.

Device 18 consists of semiconductor pellets of P-type and N-type bismuth telluride assembled to copper elements of cylindrical cross-section. When connected to DC power supply 22 the electrons flow in the direction shown to establi...