Browse Prior Art Database

Combination Cooling System

IP.com Disclosure Number: IPCOM000089947D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Seely, JH: AUTHOR

Abstract

This cooling system for closely spaced semiconductor devices allows the heat to be transferred to the ultimate heat sink at some remote point from the heat sources.

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Combination Cooling System

This cooling system for closely spaced semiconductor devices allows the heat to be transferred to the ultimate heat sink at some remote point from the heat sources.

Semiconductor devices 12 to be cooled are mounted on a thin molybdenum pad 14 by a eutectic bond 16. The chip and pad subassembly is mounted on copper strap 18. The latter is the cold junction of thermoelectric module 20 and this, in turn, is connected mechanically and thermally to flexible heat pipe 22. The thermal energy flows from the chip junction to the thermoelectric cold junction due to the driving force of the temperature gradient between them. The heat flow continues across module 20 in accordance with the principles of the Peltier heat pump. The heat enters boiler section 24 of pipe 22 from the hot junction of module 20. The heat in accordance with the principles of pipe 22, is conveyed to condenser section 26. The heat can be removed to the ultimate heat sink by the application of a convection process to section 26 of pipe 22.

Pipe 22 is a boiling-condensing system which relies on capillary action to return the condensate. Heat added at the boiler or evaporator section 24 causes the working fluid to vaporize and transfer to section 26. The vaporization- condensation process sets up a pressure gradient which causes the vapor to flow from boiler 24 to condenser 26. The condensate completely wets wick 28 and consequently is pumped back to boiler 24 by capillary actio...