Browse Prior Art Database

Wafer Transfer Unit

IP.com Disclosure Number: IPCOM000089963D
Original Publication Date: 1968-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Boerger, FE: AUTHOR [+2]

Abstract

This wafer handler unit transfers semiconductor wafers from one recessed carrier to a second recessed carrier without touching the surfaces to be processed. The handler comprises gripping fingers 1 secured to frame 2. Tied to air cylinder 3 is glide housing 4 which is mounted to a cam plate 5. The latter actuates fingers 1 into open or closed positions while concurrently controlling for both inside and outside diameter extension. Fingers 1 provide a saddle on which the wafers rest until they are released onto a processing carrier. Directly in the center of each set of fingers 1 is a blowoff tube 6. This is pulsed for a final surface cleaning prior to transfer of the wafer on a processing carrier.

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Wafer Transfer Unit

This wafer handler unit transfers semiconductor wafers from one recessed carrier to a second recessed carrier without touching the surfaces to be processed. The handler comprises gripping fingers 1 secured to frame 2. Tied to air cylinder 3 is glide housing 4 which is mounted to a cam plate 5. The latter actuates fingers 1 into open or closed positions while concurrently controlling for both inside and outside diameter extension. Fingers 1 provide a saddle on which the wafers rest until they are released onto a processing carrier. Directly in the center of each set of fingers 1 is a blowoff tube 6. This is pulsed for a final surface cleaning prior to transfer of the wafer on a processing carrier.

In operation, tray 7, carrying two wafers 8 in recess 9, is positioned under the handler. In this position, wafer lifters 10 rises to a level to enable fingers 1 to close about wafers 8. During elevation of such wafers by lifters 10, vacuum is applied via recesses 11 in lifters 10 to prevent the dislodgement of wafers 8. When these are raised to the desired position, air cylinder 3 is actuated to lower cam plate 5 which closes fingers 1 about the periphery of wafers 8. In this position, the vacuum is removed from lifters 10 which are then lowered to the original position. The handler holds wafers 8 via fingers 1 until a processing carrier is positioned under the handler. When the carrier is in position, the wafers are released onto it and are then rem...