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Altering Circuit Connections

IP.com Disclosure Number: IPCOM000089990D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Rodite, RR: AUTHOR

Abstract

This process for altering circuit connections in printed circuit cards utilizes a permanent ultraviolet-sensitive dielectric material to coat the circuit card and, in turn, an opaque coating to cover the material. Circuit changes are made by removing the opaque material and exposing the coating selectively by ultraviolet-light via a mask or controlled light source. In A, substrate 1, on which printed circuit line 2 is attached, is covered with photosensitive dielectric 3 and protective opaque covering 4. Prior to altering the circuit, the opaque coating is removed either selectively or entirely as in B and the assembly is exposed at chosen areas 5. Development removes the dielectric only in areas 6 and 7 which are exposed. Etching the assembly causes line 2 to be divided in three parts 8, 9, and 10 in C.

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Altering Circuit Connections

This process for altering circuit connections in printed circuit cards utilizes a permanent ultraviolet-sensitive dielectric material to coat the circuit card and, in turn, an opaque coating to cover the material. Circuit changes are made by removing the opaque material and exposing the coating selectively by ultraviolet- light via a mask or controlled light source. In A, substrate 1, on which printed circuit line 2 is attached, is covered with photosensitive dielectric 3 and protective opaque covering 4. Prior to altering the circuit, the opaque coating is removed either selectively or entirely as in B and the assembly is exposed at chosen areas
5. Development removes the dielectric only in areas 6 and 7 which are exposed. Etching the assembly causes line 2 to be divided in three parts 8, 9, and 10 in C. The assembly can again be exposed to ultraviolet light at 11 and 12 as in D. Subsequent development provides openings to the circuit lines as in E. Connections to the circuit lines are indicated in F by leads 13 and 14 that employ any method suited to the particular application. Opaque coating 4 is then replaced to protect the remaining dielectric from exposure.

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