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Electrophoretic Deposition of Polymer Film on a Dissimilar Metallic Substrate

IP.com Disclosure Number: IPCOM000090017D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bell, HF: AUTHOR [+2]

Abstract

The overall quality and uniformity of polymer film coatings deposited by electrophoresis on a substrate composed of dissimilar metals, for example, a substrate having surface areas of stainless steel and other surface areas covered by solder, are enhanced by precoating the entire substrate surface with one metal. Typically, the substrate is precoated with a nickel plate, e.g., Wood's Nickel, in order to obtain uniform adhesion of the subsequent copper plating on the dissimilar substrate. Copper is electrodeposited on the nickel plate in order to provide a more compatible metal base for the final polymer coat.

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Electrophoretic Deposition of Polymer Film on a Dissimilar Metallic Substrate

The overall quality and uniformity of polymer film coatings deposited by electrophoresis on a substrate composed of dissimilar metals, for example, a substrate having surface areas of stainless steel and other surface areas covered by solder, are enhanced by precoating the entire substrate surface with one metal. Typically, the substrate is precoated with a nickel plate, e.g., Wood's Nickel, in order to obtain uniform adhesion of the subsequent copper plating on the dissimilar substrate. Copper is electrodeposited on the nickel plate in order to provide a more compatible metal base for the final polymer coat.

The process includes the use of a silk screened ink to mask surface areas of the dissimilar metallic substrate which are to be left uncoated. The partially masked surface is prepared for the coating process by cleansing with a commercial abrasive cleanser, rinsing with deionized water, and immersing the substrate in a 1:1 solution of hydrochloric acid and water. Next, the nickel coating is applied from an electroplating bath. A plating current of 50 amp/sq. ft. is sustained for 1.5 minutes. After additional rinsing, the copper coating is applied from a second bath at 50 amp/sq. ft. for 5 minutes.

After further rinsing and drying, the polymer coating is deposited from a bath containing a freshly prepared 75/25 weight percent mixture of FEP 120 fluorocarbon, du Pont, and epoxy, CIBA...