Browse Prior Art Database

Multilayer Laminates

IP.com Disclosure Number: IPCOM000090029D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Hermann, K: AUTHOR

Abstract

This system of constructing multilayer circuit panels to provide through connections is adaptable to continuous processing. Continuous core, dielectric material 1 has bonded to it upper and lower conductive copper sheets 2 and 3. These are etched to provide a pattern of holes 4 and disks 5 located directly below the holes as at A. Utilizing sheet 2 to provide the pattern, dielectric 1 is etched away to create holes 6 as at B. Mechanical equipment provides dimple 7 in disks. As at C, a combination of solder and flux 8 is placed in holes 6 and on dimples 7. The solder is reflowed by any of several methods. Dielectric 9, of less thickness than the combined height of dimple 7 and solder 8 is next applied electrophoretically to the lower conductive surface. This assembly can then be stored for future processing.

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Multilayer Laminates

This system of constructing multilayer circuit panels to provide through connections is adaptable to continuous processing. Continuous core, dielectric material 1 has bonded to it upper and lower conductive copper sheets 2 and 3. These are etched to provide a pattern of holes 4 and disks 5 located directly below the holes as at A. Utilizing sheet 2 to provide the pattern, dielectric 1 is etched away to create holes 6 as at B. Mechanical equipment provides dimple 7 in disks. As at C, a combination of solder and flux 8 is placed in holes 6 and on dimples 7. The solder is reflowed by any of several methods. Dielectric 9, of less thickness than the combined height of dimple 7 and solder 8 is next applied electrophoretically to the lower conductive surface. This assembly can then be stored for future processing. The individual assemblies are further processed by applying a photoresist to the top substrate followed by developing, etching, and resist removal to prepare the assembly for final lamination. The assemblies thus prepared are stacked as at D. They are then laminated in a press with adequate temperature to cure the dielectric and to reflow the solder to make the through- connections.

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