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Installation of Chips on Printed Circuit Cards

IP.com Disclosure Number: IPCOM000090036D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Cameron, JM: AUTHOR [+2]

Abstract

This packaging technique permits the installation of the electronic chips directly onto the printed circuit card of glass-epoxy, ceramic, phenolic, or other similar compositions without need for an interfacing element. In addition, the chip is encapsulated in a liquid having good thermal characteristics to increase heat dissipation of the individual circuit chips. Card 1 in A has a plurality of circuit conductive lines 2 that terminate in hole locations. Chip 3 in B and in the enlarged section has conductive protuberances 5, adapted to engage dimples 4 in the circuit line to accurately locate the chip. Chip to circuit connection is provided by techniques such as solder reflow, ultrasonic welding, etc. Material 6 that is thermally conductive and electrically insulating is next applied on card 1.

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Installation of Chips on Printed Circuit Cards

This packaging technique permits the installation of the electronic chips directly onto the printed circuit card of glass-epoxy, ceramic, phenolic, or other similar compositions without need for an interfacing element. In addition, the chip is encapsulated in a liquid having good thermal characteristics to increase heat dissipation of the individual circuit chips. Card 1 in A has a plurality of circuit conductive lines 2 that terminate in hole locations. Chip 3 in B and in the enlarged section has conductive protuberances 5, adapted to engage dimples 4 in the circuit line to accurately locate the chip. Chip to circuit connection is provided by techniques such as solder reflow, ultrasonic welding, etc. Material 6 that is thermally conductive and electrically insulating is next applied on card 1.

A proper quantity of an organic or ceramic material such as multiple lead - IVB oxide is then applied and allowed to harden to form elastic ceramic dome-shaped globules 7 over chips 1. An alternate method of providing a cover is shown C. After the thermally conductive and electrically insulating material 6 is applied, a separate cover 8 is placed on the assembly and secured to it by epoxy 9.

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