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Tri Lead Shielding for Printed Wiring

IP.com Disclosure Number: IPCOM000090038D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Stephans, E: AUTHOR

Abstract

Crosstalk interference on printed circuit boards and ceramic modules can be limited by employing this tri-lead shielding technique. Circuit board 1 is provided with two signal lines 2 per channel and a ground line 3 positioned between. In addition, the via hole lines 4 can be used for a ground line if the via hole is not needed for a feed-through connection. The appropriate ground lines can be programmed into the arrangement of the signal line pattern and deposited at the same time as these signal lines.

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Tri Lead Shielding for Printed Wiring

Crosstalk interference on printed circuit boards and ceramic modules can be limited by employing this tri-lead shielding technique. Circuit board 1 is provided with two signal lines 2 per channel and a ground line 3 positioned between. In addition, the via hole lines 4 can be used for a ground line if the via hole is not needed for a feed-through connection. The appropriate ground lines can be programmed into the arrangement of the signal line pattern and deposited at the same time as these signal lines.

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