Browse Prior Art Database

Unit Module Lead Frame Using Polyimide

IP.com Disclosure Number: IPCOM000090050D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Stephans, E: AUTHOR

Abstract

Interconnections between circuit chips and the I/O circuitry of multilayer laminates is accomplished by this connection arrangement. A flexible polyimide sheet provided with a circuit transformation pattern is used. A multilayer module is fabricated of a plurality of layers of dielectric, adhesives, conductors and polyimides with a plurality of integrated circuit chips thereon that are bonded together on a heat sink. A copper layer, attached to heat sink 1 by adhesive 2, is etched to provide a plurality of circuits 3. Another layer of adhesive 4 is used to apply polyimide sheet 5. Polyimide sheet 6, provided with circuit elements 7 and 8, is secured by adhesive 9 to the existing circuit stack. A top sheet of polyimide 10 with a circuit 11 etched on it is also fastened by adhesive 12 to the stacked module.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Unit Module Lead Frame Using Polyimide

Interconnections between circuit chips and the I/O circuitry of multilayer laminates is accomplished by this connection arrangement. A flexible polyimide sheet provided with a circuit transformation pattern is used. A multilayer module is fabricated of a plurality of layers of dielectric, adhesives, conductors and polyimides with a plurality of integrated circuit chips thereon that are bonded together on a heat sink. A copper layer, attached to heat sink 1 by adhesive 2, is etched to provide a plurality of circuits 3.

Another layer of adhesive 4 is used to apply polyimide sheet 5. Polyimide sheet 6, provided with circuit elements 7 and 8, is secured by adhesive 9 to the existing circuit stack. A top sheet of polyimide 10 with a circuit 11 etched on it is also fastened by adhesive 12 to the stacked module. Sheet 10, provided with circuit transformation wiring 13, extends beyond the module as at 14 and is folded back upon itself prior to connection to protuberances 15 on circuit chip 16 by a solder reflow or similar process. Chip 16 is fastened to heat sink 17 which is positioned in a cavity in the module and is fastened to heat sink 1 by soldering. Through-connection between circuit planes is provided by plated through-holes 18.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]