Browse Prior Art Database

Injected Interconnections

IP.com Disclosure Number: IPCOM000090052D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Ellis, TL: AUTHOR

Abstract

Fabrication of connecting conductors between circuit planes on opposite sides of an insulating layer can be achieved. A sheet of conductive material is placed against the circuit bearing card and applying heat and pressure to force the now plastic conductor into the through-holes. In A, circuit board 1 with holes 2 is placed between upper and lower planishing plates 3 and 4. A thin sheet of conductive material 5 such as tin-lead is placed between board 1 and one of the planishing plates. Heat and pressure are applied to force material 5 into the holes in B. Then the excess tin-lead is removed by scraping, shaving or melting. Copper plating 6 can be added to both sides on the copper and the tin-lead through connection.

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Injected Interconnections

Fabrication of connecting conductors between circuit planes on opposite sides of an insulating layer can be achieved. A sheet of conductive material is placed against the circuit bearing card and applying heat and pressure to force the now plastic conductor into the through-holes. In A, circuit board 1 with holes 2 is placed between upper and lower planishing plates 3 and 4. A thin sheet of conductive material 5 such as tin-lead is placed between board 1 and one of the planishing plates. Heat and pressure are applied to force material 5 into the holes in B. Then the excess tin-lead is removed by scraping, shaving or melting. Copper plating 6 can be added to both sides on the copper and the tin-lead through connection. The copper is then removed in selected areas leaving circuit lines and through connectors with copper plated caps extending above the laminate as shown at C.

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