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Catalysis for Electroless Copper Plating

IP.com Disclosure Number: IPCOM000090057D
Original Publication Date: 1969-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bailey, PJ: AUTHOR [+2]

Abstract

Thermally stabled nonconductive substrates are pretreated with a thin coating of palladium-polyethylenimine chelate polymer film. This is thermally decomposed to leave a fine deposit of Pd/o/ prior to electroless plating. The substrate is dipped into a very dilute aqueous solution of the PdII-polyethylenimine chelate polymer and is air-dried to leave a very thin continuous film having uniformly distributed in it discrete

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Catalysis for Electroless Copper Plating

Thermally stabled nonconductive substrates are pretreated with a thin coating of palladium-polyethylenimine chelate polymer film. This is thermally decomposed to leave a fine deposit of Pd/o/ prior to electroless plating. The substrate is dipped into a very dilute aqueous solution of the PdII- polyethylenimine chelate polymer and is air-dried to leave a very thin continuous film having uniformly distributed in it discrete

The chelate polymer film is decomposed thermally at temperatures from about 250 degrees C to 600 degrees C in a quiescent atmosphere of air or inert gas. After cooling, the Pd/o/ coated substrate is plated by immersing it in an electroless copper plating bath.

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