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Purification of Low Melting Point Alloy

IP.com Disclosure Number: IPCOM000090104D
Original Publication Date: 1969-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hartzell, AM: AUTHOR

Abstract

A bismuth-indium-tin alloy having a melting point of about 174 degrees F is used to hold reed switch levers in plating fixtures while contact materials are plated on the levers. During the plating and associated processes, the alloy picks up oxides, dirt, and other contaminants. These contaminants make the alloy unsuitable for subsequent use with the plating baths. The contaminants can be removed without substantially altering the original composition or melting point of the alloy by heating the contaminated alloy in boiling water for a sufficient time to dissolve or float away the impurities. The heating operation is conveniently carried out in a vessel having an outlet at the bottom, thus allowing easy removal of the purified alloy in the liquid state from the water.

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Purification of Low Melting Point Alloy

A bismuth-indium-tin alloy having a melting point of about 174 degrees F is used to hold reed switch levers in plating fixtures while contact materials are plated on the levers. During the plating and associated processes, the alloy picks up oxides, dirt, and other contaminants. These contaminants make the alloy unsuitable for subsequent use with the plating baths. The contaminants can be removed without substantially altering the original composition or melting point of the alloy by heating the contaminated alloy in boiling water for a sufficient time to dissolve or float away the impurities. The heating operation is conveniently carried out in a vessel having an outlet at the bottom, thus allowing easy removal of the purified alloy in the liquid state from the water. The alloy purified in this way meets the stringent requirements for the reed switch plating operation.

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