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Temperature Controlled Immersed Cooling System

IP.com Disclosure Number: IPCOM000090118D
Original Publication Date: 1969-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Councill, ED: AUTHOR [+4]

Abstract

The electronic package, immersed in container 10 of dielectric cooling fluid 16, consists of central array 12 and a plurality of cards 14 carrying heat generating electronic components not shown. The fluid 16 level is maintained above heat exchanger 18 and perforated plate support 20 for diaphragm 22. The heat transfer from the electronic modules to fluid 16 is accomplished by natural convection and boiling, i.e., sub-cooled boiling. The heat accumulated by fluid 16 is transferred to exchanger 18 by natural convection where it is removed by circulating chilled water applied to such exchanger via pipes 24. The average fluid 16 temperature, except for the array 12 area, is controlled essentially by the inlet chilled water temperature and the power consumed by the electronic components.

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Temperature Controlled Immersed Cooling System

The electronic package, immersed in container 10 of dielectric cooling fluid 16, consists of central array 12 and a plurality of cards 14 carrying heat generating electronic components not shown. The fluid 16 level is maintained above heat exchanger 18 and perforated plate support 20 for diaphragm 22. The heat transfer from the electronic modules to fluid 16 is accomplished by natural convection and boiling, i.e., sub-cooled boiling. The heat accumulated by fluid 16 is transferred to exchanger 18 by natural convection where it is removed by circulating chilled water applied to such exchanger via pipes 24. The average fluid 16 temperature, except for the array 12 area, is controlled essentially by the inlet chilled water temperature and the power consumed by the electronic components.

The array 12 area is baffled on four sides to isolate the fluid within such area from the bulk fluid 16 without. Array area 12 has caps 26 and 28 to restrict fluid flow through such area. Top cap 26 has a small hole 30 which allows a predetermined amount of fluid to circulate through array area 12. Bottom cap 28 includes heater 32 and thermistor probe 34 which are connected to a proportional controller, not shown, to maintain the fluid in array area 12 at a predetermined temperature. When full power is applied to the components in array area 12, a sufficient amount of circulation occurs through the array via openings 36 in cap 28 and hol...