Browse Prior Art Database

Fabrication of Multichannel Vias

IP.com Disclosure Number: IPCOM000090123D
Original Publication Date: 1969-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Cutillo, JG: AUTHOR [+2]

Abstract

This process maintains electrical isolation of a center conductor by electrophoretically depositing an insulator between the conductors in a plated through-hole. As shown at A, a four-plane laminate containing through-holes 1 is provided with an electroless and electrolytic plating 2 on the walls of the holes. photoresist 3, as shown at B, is next applied to the laminate prior to the deposition of an insulator 4 by an electrophoretic process. The opening is then filled with conductor 5 and photoresist 3 is stripped to provide the laminate shown at C.

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Fabrication of Multichannel Vias

This process maintains electrical isolation of a center conductor by electrophoretically depositing an insulator between the conductors in a plated through-hole. As shown at A, a four-plane laminate containing through-holes 1 is provided with an electroless and electrolytic plating 2 on the walls of the holes. photoresist 3, as shown at B, is next applied to the laminate prior to the deposition of an insulator 4 by an electrophoretic process. The opening is then filled with conductor 5 and photoresist 3 is stripped to provide the laminate shown at C.

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