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CP Water Soluble Flux

IP.com Disclosure Number: IPCOM000090156D
Original Publication Date: 1969-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Poliak, RM: AUTHOR [+2]

Abstract

A water soluble soldering flux is formulated as follows: Amides 1%-5% Hydroxydicarboxylic Acids 1%-10% Alcohols 10%-90% Acetylacetone 10%-90%

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CP Water Soluble Flux

A water soluble soldering flux is formulated as follows:

Amides 1%-5%

Hydroxydicarboxylic Acids 1%-10%

Alcohols 10%-90%

Acetylacetone 10%-90%

A specific formulation is:

Urea 2 grams

Malic Acid 4 grams

Methanol 50 grams

Acetylacetone 50 grams.

The flux is suitable for soldering Cu, Ni plate, SnPb and immersion Sn metal parts. The flux is compounded to leave minimum residues after soldering that are readily soluble in water.

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