Browse Prior Art Database

Module Removing Tool

IP.com Disclosure Number: IPCOM000090260D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Lissner, RW: AUTHOR

Abstract

The tool is for removing multipin logic circuit module 1 from logic card 2. The latter is inserted by pulling handles 3. Then infrared heater 4 is energized for melting solder joints 6. When the solder is melted, the force of spring 7 lifts assembly 8 holding module 1 from card 2.

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Module Removing Tool

The tool is for removing multipin logic circuit module 1 from logic card 2. The latter is inserted by pulling handles 3. Then infrared heater 4 is energized for melting solder joints 6. When the solder is melted, the force of spring 7 lifts assembly 8 holding module 1 from card 2.

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