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Multilayer Circuit

IP.com Disclosure Number: IPCOM000090275D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Haining, FW: AUTHOR [+2]

Abstract

Multilayer circuitry is prepared by following this sequence of steps. A signal plane is formed on a suitable substrate, followed by the lamination of RISTON* on it, a film photoresist, that when completely cross-linked serves as a dielectric. The RISTON coating is masked in a predetermined pattern that forms interconnections between layers, exposed to actinic radiation, and developed. The developed RISTON pattern is then coated and, at the same time, vias are filled with a metal chelate polymer, e.g., palladium, and heated to a temperature of about 250 degrees C to convert the palladium chelate polymer to a palladium film. Other metal producing metallo-organic compositions can also be used. A copper film is then plated onto the palladium film, either by electroless or electrolytic plating techniques or both.

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Multilayer Circuit

Multilayer circuitry is prepared by following this sequence of steps. A signal plane is formed on a suitable substrate, followed by the lamination of RISTON* on it, a film photoresist, that when completely cross-linked serves as a dielectric. The RISTON coating is masked in a predetermined pattern that forms interconnections between layers, exposed to actinic radiation, and developed. The developed RISTON pattern is then coated and, at the same time, vias are filled with a metal chelate polymer, e.g., palladium, and heated to a temperature of about 250 degrees C to convert the palladium chelate polymer to a palladium film. Other metal producing metallo-organic compositions can also be used. A copper film is then plated onto the palladium film, either by electroless or electrolytic plating techniques or both. The copper layer is then etched in a predetermined pattern to form a second signal plane. Additional layers of signal planes can be prepared by repeating the sequence of steps. *Trademark of E. I. du Pont de Nemours and Co.

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