Browse Prior Art Database

Heat Sink

IP.com Disclosure Number: IPCOM000090277D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Bryden, JR: AUTHOR

Abstract

A problem with mounting silicon integrated circuit semiconductor chips on metallic heat sinks is the thermal expansion mismatch between the silicon and the heat sink material such as copper. This problem is overcome by using a dissected heat sink. Silicon chip 10 has an integrated circuit pattern 12 on its front surface 14. The heat sink includes copper base 16. Projecting from base 16 is plateau 18 of copper that is dissected into pillars 20. The backside 22 of chip 10 is mounted on plateau 18 allowing a plurality of pillars 20 to contact backside 22 of chip 10. Pillars 20 in plateau 18 are capable of moving when the temperature of chip 10 and plateau 18 changes. This compensates for the thermal mismatch between silicon and copper, thus reducing the strain in the silicon-copper bond.

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Heat Sink

A problem with mounting silicon integrated circuit semiconductor chips on metallic heat sinks is the thermal expansion mismatch between the silicon and the heat sink material such as copper. This problem is overcome by using a dissected heat sink. Silicon chip 10 has an integrated circuit pattern 12 on its front surface 14. The heat sink includes copper base 16. Projecting from base 16 is plateau 18 of copper that is dissected into pillars 20. The backside 22 of chip 10 is mounted on plateau 18 allowing a plurality of pillars 20 to contact backside 22 of chip 10. Pillars 20 in plateau 18 are capable of moving when the temperature of chip 10 and plateau 18 changes. This compensates for the thermal mismatch between silicon and copper, thus reducing the strain in the silicon-copper bond. Individual copper rods soldered onto copper base 16 to form a similar plateau can be substituted for pillars 20.

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