Browse Prior Art Database

Screening of Land Patterns

IP.com Disclosure Number: IPCOM000090293D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Remsen, LP: AUTHOR

Abstract

In conventional semiconductor component fabrication, the semiconductor chip is joined to a conductive land pattern on a ceramic substrate. The conductive land pattern is formed by screening conductive paste through a screen having the selected pattern onto the ceramic substrate. With the advancing technology, the patterns screened on the substrate increase in fineness. These finer patterns show a tendency towards voids in the end portion of the lands to which the pads of the mounted chip are to be joined. This can interfere with an acceptable contact being made by the pad to the land. In order to avoid this problem, the mesh is removed from the screen in the areas coinciding with the portions of the land patterns to which pads are to be joined. The drawing shows a portion of such a screen.

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Screening of Land Patterns

In conventional semiconductor component fabrication, the semiconductor chip is joined to a conductive land pattern on a ceramic substrate. The conductive land pattern is formed by screening conductive paste through a screen having the selected pattern onto the ceramic substrate. With the advancing technology, the patterns screened on the substrate increase in fineness. These finer patterns show a tendency towards voids in the end portion of the lands to which the pads of the mounted chip are to be joined. This can interfere with an acceptable contact being made by the pad to the land. In order to avoid this problem, the mesh is removed from the screen in the areas coinciding with the portions of the land patterns to which pads are to be joined. The drawing shows a portion of such a screen. Impervious substrate 10 has opening 11 formed in it. A portion 12 of opening 11 is covered by mesh while the end portion 13 of such opening is not covered by mesh.

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