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Screen for Conductive Paste Deposition

IP.com Disclosure Number: IPCOM000090295D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Harris, FW: AUTHOR

Abstract

A screen member is used in the deposition of flowable materials, such as conductive paste, onto a substrate in a selected pattern. The screen or stencil is used in conventional techniques. With these the screen is placed in contact with the substrate and metering squeegee 10 forces paste 11 through aperture 12 in stencil or screen 13 onto substrate 14. A more uniform paste distribution on substrate 14 is achieved if the openings in the screen or stencil are stepped. Thus, lower portion 15 of the opening, which is adjacent to substrate 14, has a greater dimension than upper portion 12 of the opening which is in contact with squeegee 10. Preferably, the area of portion 12 of the opening is from 50% to 70% of the area of portion 15 of the opening.

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Screen for Conductive Paste Deposition

A screen member is used in the deposition of flowable materials, such as conductive paste, onto a substrate in a selected pattern. The screen or stencil is used in conventional techniques. With these the screen is placed in contact with the substrate and metering squeegee 10 forces paste 11 through aperture 12 in stencil or screen 13 onto substrate 14. A more uniform paste distribution on substrate 14 is achieved if the openings in the screen or stencil are stepped. Thus, lower portion 15 of the opening, which is adjacent to substrate 14, has a greater dimension than upper portion 12 of the opening which is in contact with squeegee 10. Preferably, the area of portion 12 of the opening is from 50% to 70% of the area of portion 15 of the opening. This ratio is also of significance even when the upper portion of the opening is not a single opening, as in A, but a plurality of openings which are connected with a single lower opening, as in B. The screen configuration can also be used for controlling the heights of the deposited materials.

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