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Cam Actuated Socket Contact

IP.com Disclosure Number: IPCOM000090300D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Kehagioglou, T: AUTHOR

Abstract

This device makes electrical contact with a plurality of conductive pins. Disk-shaped plastic member 10 is adapted to receive a plurality of pins 12. Member 10 also receives the actuators comprising two sections of expandable tubing 14 and 15 which are connected to separate sources of fluid pressure via fittings 16. Other actuators such as pistons or springs can also be used. Plastic wafer 18 which acts as a plate cam is positioned over member 10 and hose 14 by locating holes. Wafer 18 has a plurality of rectangular holes through which pins 12 are inserted into member 10 where they remain locked in place. The second section of rubber tubing 15 is then placed over wafer 18 and disk-shaped plastic member 20 is placed over tubing 15. The device is held together by screws 21.

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Cam Actuated Socket Contact

This device makes electrical contact with a plurality of conductive pins. Disk- shaped plastic member 10 is adapted to receive a plurality of pins 12. Member 10 also receives the actuators comprising two sections of expandable tubing 14 and 15 which are connected to separate sources of fluid pressure via fittings 16. Other actuators such as pistons or springs can also be used. Plastic wafer 18 which acts as a plate cam is positioned over member 10 and hose 14 by locating holes. Wafer 18 has a plurality of rectangular holes through which pins 12 are inserted into member 10 where they remain locked in place. The second section of rubber tubing 15 is then placed over wafer 18 and disk-shaped plastic member 20 is placed over tubing 15. The device is held together by screws 21.

In operation, hose 15 exerts pressure on wafer 18 maintaining hose 14 in a compressed state. Conductive pins, for example of the type protruding from an integrated circuit module are plugged into holes 22 in member 20. Holes 22 can be counterbored for facilitating insertion.

The source of air pressure for tube 14 is then activated, forcing wafer 18 upward thus compressing tube 15. This is disconnected from its source of air pressure, causing the U-shaped portion of pins 12 to grasp conductive pins 24. In this way, a plurality of electrically conductive pins 24 can be inserted into holes 22 for contact with pins 12 without friction.

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