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Producing Insulating Layers between Module Conductor Planes

IP.com Disclosure Number: IPCOM000090318D
Original Publication Date: 1969-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Brandauer, G: AUTHOR [+5]

Abstract

The manufacture of multilayer modules necessitates the realization of insulating interfaces between the individual conductor planes, the surface extension of which considerably exceeds that of conductor crossings on single-layer modules. In the case of large surfaces, the use of pure glass is unsuitable for the manufacture of such insulating interfaces. This is mainly due to the fact that stoving of the glass layer, applied by silk screen printing, leads to the glass layers previously applied being softened. This, in turn, results in a random displacement of the different glass layers and the conductor patterns arranged on top of each other. During recooling of such modules, the tensions produced frequently lead to the conductors rupturing.

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Producing Insulating Layers between Module Conductor Planes

The manufacture of multilayer modules necessitates the realization of insulating interfaces between the individual conductor planes, the surface extension of which considerably exceeds that of conductor crossings on single- layer modules. In the case of large surfaces, the use of pure glass is unsuitable for the manufacture of such insulating interfaces. This is mainly due to the fact that stoving of the glass layer, applied by silk screen printing, leads to the glass layers previously applied being softened. This, in turn, results in a random displacement of the different glass layers and the conductor patterns arranged on top of each other. During recooling of such modules, the tensions produced frequently lead to the conductors rupturing.

These difficulties can be avoided by manufacturing the insulating interfaces of a mixture of pure glass and Al(2)O(3), using different grain sizes for the Al(2)O(3) so that a high packing density of the insulating layers is obtained.

For the manufacture of the multilayer module proper or the associated conductor planes, orthodox methods, such as electroless plating, plating, in particular the electrolytic deposition of gold, which in comparison with copper has proved to be particularly compatible with the glass substance even at high temperatures, are used.

The more favorable characteristics of the multilayer structure in comparison with the use of pure glass insulat...