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Printed Circuit Production

IP.com Disclosure Number: IPCOM000090371D
Original Publication Date: 1969-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Karner, FA: AUTHOR [+3]

Abstract

Circuit lines can be formed on a substrate without masks and photoresists upon subjecting the metallic coating to bombardment by an electron beam with the proper parameters. After exposure, the substrate is placed in an etchant which removes the portion of the metal that is not exposed to the electron bombardment. The exposed portions of the metallic coating etch at a slower rate, leaving the circuit lines which can then be plated to increase their thickness.

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Printed Circuit Production

Circuit lines can be formed on a substrate without masks and photoresists upon subjecting the metallic coating to bombardment by an electron beam with the proper parameters. After exposure, the substrate is placed in an etchant which removes the portion of the metal that is not exposed to the electron bombardment. The exposed portions of the metallic coating etch at a slower rate, leaving the circuit lines which can then be plated to increase their thickness.

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