Browse Prior Art Database

Wafer Identification

IP.com Disclosure Number: IPCOM000090419D
Original Publication Date: 1969-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Rottmann, HR: AUTHOR

Abstract

Photoelectric scanning of semiconductor surfaces allows wafer identification where information is stored in kerf areas 1 of wafer 2, drawing A, in the form of digitized etched lines 3. Need for orientation of wafer 1 is eliminated by replication of the information in a plurality of rows 4 of angulated etched lines successively rotated from each other. In rows 4...7, successive adjacent rows are rotated at 30 degrees intervals relative to each other and rows 8 and 9 are rotated 45 degrees. In this manner, regardless the orientation of wafer 1, as scan slit 10 traverses the wafer surface the information in one of rows 4...9 is presented for reading. Total information in rows 4...9 can be effected by rotation of the scan path in angular increments defining scanning paths such as A...

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Wafer Identification

Photoelectric scanning of semiconductor surfaces allows wafer identification where information is stored in kerf areas 1 of wafer 2, drawing A, in the form of digitized etched lines 3. Need for orientation of wafer 1 is eliminated by replication of the information in a plurality of rows 4 of angulated etched lines successively rotated from each other. In rows 4...7, successive adjacent rows are rotated at 30 degrees intervals relative to each other and rows 8 and 9 are rotated 45 degrees. In this manner, regardless the orientation of wafer 1, as scan slit 10 traverses the wafer surface the information in one of rows 4...9 is presented for reading. Total information in rows 4...9 can be effected by rotation of the scan path in angular increments defining scanning paths such as A...E shown in drawing B or by translation of the scan path perpendicular to the direction of scanning.

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