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Conductive Interconnector Simulator

IP.com Disclosure Number: IPCOM000090438D
Original Publication Date: 1969-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

McMahon, MT: AUTHOR [+2]

Abstract

A simulator board structure is for determining the feasibility in design of conductive interconnector paths in semiconductor integrated circuits utilizing such interconnectors. In automated fabrication of integrated circuits, one approach is to utilize a master semiconductor chip having a standardized array of active and passive elements. A desired circuit is tailored by selectively forming interconnections between combinations of these active and passive elements. Of necessity, in such a structure, the interconnectors have to cross over each other. Such crossovers are accomplished by a multilayer interconnector structure.

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Conductive Interconnector Simulator

A simulator board structure is for determining the feasibility in design of conductive interconnector paths in semiconductor integrated circuits utilizing such interconnectors. In automated fabrication of integrated circuits, one approach is to utilize a master semiconductor chip having a standardized array of active and passive elements. A desired circuit is tailored by selectively forming interconnections between combinations of these active and passive elements. Of necessity, in such a structure, the interconnectors have to cross over each other. Such crossovers are accomplished by a multilayer interconnector structure.

This simulator is capable of simulating the selected interconnector pattern from information stored in a conventional punched card. The simulator comprises a plurality of planes, each of which contains discrete insulated strips of conductive material. The planes are separated from each other by insulative layers. The structure shown contains four such planes X1 and X2 in which the conductive strips 10 are disposed parallel to the X axis and planes Y1 and Y2 in which the conductive strips 11 are disposed parallel to the Y axis. Insulating layers 12 separate the four planes. Openings 13 extend through the entire composite and are disposed so that, with the exception of the peripheral conductive strips, substantially all of conductive strips 10 and 11 have three apertures 13 passing through.

The strips are disposed so that the apertures passing through the ends of the strips are in registration with apertures passing through the ends of parallel strips in the next...