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Electroless Copper Receptive Dielectric Coatings for SMIS

IP.com Disclosure Number: IPCOM000090499D
Original Publication Date: 1969-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Canestaro, MJ: AUTHOR [+4]

Abstract

Dielectric surfaces for electroless copper deposition arc prepared according to this process. An epoxy resin is cast or potted from a solventless solution onto a suitable substrate. The resin is partially cured, or B-staged, at a temperature of about 80 degrees C to about 120 degrees C. The B-staged resin layer is then surface ground to the desired thickness and is then dipped in a suspension of calcium carbonate particles suspended in FREON*. The now calcium carbonate coated epoxy layer is fully cured or C-staged. After curing the calcium carbonate coated epoxy layer, it is suspended in a HCl leaching bath in which the calcium carbonate is leached from the epoxy layer thus producing a microroughened surface. The fully cured surface-microroughened layer is now ready to accept an adherent electroless copper deposition.

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Electroless Copper Receptive Dielectric Coatings for SMIS

Dielectric surfaces for electroless copper deposition arc prepared according to this process. An epoxy resin is cast or potted from a solventless solution onto a suitable substrate. The resin is partially cured, or B-staged, at a temperature of about 80 degrees C to about 120 degrees C. The B-staged resin layer is then surface ground to the desired thickness and is then dipped in a suspension of calcium carbonate particles suspended in FREON*. The now calcium carbonate coated epoxy layer is fully cured or C-staged. After curing the calcium carbonate coated epoxy layer, it is suspended in a HCl leaching bath in which the calcium carbonate is leached from the epoxy layer thus producing a microroughened surface. The fully cured surface-microroughened layer is now ready to accept an adherent electroless copper deposition. Satisfactory epoxy formulations this method are

1. DER-667, a diglycidyl ether of bisphenol A, epoxide equivalent 1600 to 2000, prepared by Dow Chemical Company. Cellosolve

Methylene Dianiline

Cab-O-Sil.

2. Ciba CY 179 epoxy resin, epichlorohydrin and bisphenol A, epoxy equivalent 139, prepared by The CIBA Corporation. Conap DF-3164 polyester flexibilizer

Nadic Methyl Anhydride Hardener

Ciba Accelerator 065.

3. DER 332 epoxy resin, epichlorohydrin and bisphenol A, epoxy equivalent 173-179, prepared by Dow Chemical Company.

Epon 828 epoxy resin, diglycidyl ether of bisphenol A, epoxy equivalen...