Browse Prior Art Database

Oxidation Prevention

IP.com Disclosure Number: IPCOM000090540D
Original Publication Date: 1969-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Mele, JJ: AUTHOR

Abstract

This apparatus prevents the oxidation of exposed metal surfaces as a result of heat produced in wave soldering. Bell jar 10 receives nitrogen or other inert gases and functions as an equalizer in distributing the gas to wave soldering apparatus 12. This includes a series of clamps 14 for holding an object 16 to be immersed in solder bath 18 through which waves are generated by devices not shown. Associated with each clamp 14 is a tube 20 which connects to jar 10. When the lower surface of object 16 is dipped in the solder and drawn through it, the inert gas is distributed across its top surface. The inert gas prevents oxidation of any metal members as a result of the solder temperature which is 350 degrees C. Next, the top surface is dipped into the solder and pulled through to complete tinning.

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Oxidation Prevention

This apparatus prevents the oxidation of exposed metal surfaces as a result of heat produced in wave soldering. Bell jar 10 receives nitrogen or other inert gases and functions as an equalizer in distributing the gas to wave soldering apparatus 12. This includes a series of clamps 14 for holding an object 16 to be immersed in solder bath 18 through which waves are generated by devices not shown. Associated with each clamp 14 is a tube 20 which connects to jar 10. When the lower surface of object 16 is dipped in the solder and drawn through it, the inert gas is distributed across its top surface. The inert gas prevents oxidation of any metal members as a result of the solder temperature which is 350 degrees C. Next, the top surface is dipped into the solder and pulled through to complete tinning. During the operation the inert gas is not provided. Where the thermal stress through object 16 is severe, it is desirable to elevate the temperature of the inert gas. Standard ceramic heaters are installed in the distributing lines or other suitable locations to heat the gas to proper temperature. The final temperature selected prevents any thermal stress from being established in object 16 as a result of the solder temperature.

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