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Preparing Multilevel Integrated Circuits

IP.com Disclosure Number: IPCOM000090554D
Original Publication Date: 1969-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Berenbaum, L: AUTHOR

Abstract

Multilevel integrated circuits are prepared, drawing 1, by coating a SiO(2) layer with a photoresist. The coated SiO(2) is subjected to reverse sputtering under a predetermined pattern to effect a channel in it. A metal is deposited in the channel conventionally to provide a conducting stripe metal deposition. After the photoresist is removed, additional levels of circuitry are obtained by sputtering quartz over the above-prepared circuit and repeating the steps. Another method of preparing the circuitry is shown in drawing 2. A silicon substrate is chemically etched to form a channel in it. A SiO(2) layer is then deposited by thermal oxidation of the silicon substrate. The conducting metal is then deposited in the channel. Excess metal is removed and additional layers are formed as above.

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Preparing Multilevel Integrated Circuits

Multilevel integrated circuits are prepared, drawing 1, by coating a SiO(2) layer with a photoresist. The coated SiO(2) is subjected to reverse sputtering under a predetermined pattern to effect a channel in it. A metal is deposited in the channel conventionally to provide a conducting stripe metal deposition. After the photoresist is removed, additional levels of circuitry are obtained by sputtering quartz over the above-prepared circuit and repeating the steps. Another method of preparing the circuitry is shown in drawing 2. A silicon substrate is chemically etched to form a channel in it. A SiO(2) layer is then deposited by thermal oxidation of the silicon substrate. The conducting metal is then deposited in the channel. Excess metal is removed and additional layers are formed as above. Multilevel integrated circuits with high-packing densities are prepared in this manner. The circuits are void of the shadowing effects which occur when they are prepared by the usual methods.

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