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Removal of Photoresist Residue

IP.com Disclosure Number: IPCOM000090574D
Original Publication Date: 1969-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

McPherson, AJ: AUTHOR [+2]

Abstract

Electropolishing offers an efficient, thorough method of removing otherwise inaccessible bits of photoresist after development on printed circuit planes. After development of the exposed photoresist on the conductive coating, the substrate is immersed in an electropolishing bath and subjected to a high-current density of 100 to 1000 amperes per square foot. The workpiece is made anodic. An electrolyte for copper is 75% solution of phosphoric acid in water with 3% copper oxide added or a 10% solution of sodium triphosphate in water with 3% boric acid added. Electropolishing is especially effective in removing small fillets of residue at the bottom edges of hole and line images. If found required, the electropolishing step can be proceeded by use of a vapor blast containing a fine grit.

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Removal of Photoresist Residue

Electropolishing offers an efficient, thorough method of removing otherwise inaccessible bits of photoresist after development on printed circuit planes. After development of the exposed photoresist on the conductive coating, the substrate is immersed in an electropolishing bath and subjected to a high-current density of 100 to 1000 amperes per square foot. The workpiece is made anodic. An electrolyte for copper is 75% solution of phosphoric acid in water with 3% copper oxide added or a 10% solution of sodium triphosphate in water with 3% boric acid added. Electropolishing is especially effective in removing small fillets of residue at the bottom edges of hole and line images. If found required, the electropolishing step can be proceeded by use of a vapor blast containing a fine grit.

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