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Making Electrical Contact Pins

IP.com Disclosure Number: IPCOM000090611D
Original Publication Date: 1969-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Magee, RA: AUTHOR [+2]

Abstract

These gold-coated electrical contact pins are mounted in multilayer printed circuit boards. A pin 12 is mounted in composite board 10 having three multilayer board sections 14, 16, and 18. The latter are superimposed one upon another and mounted on a plurality of such contact pins. A pin 12 has an elongated base of electrical conductive material and heavy gold-plating on end portions 40 and 42 end thin gold-plating on center region 60. A pin 12 is soldered in board 10 through holes 20, 22, and 24 by solder fillets 30, 32, 34, and 36. The latter, due to the thin gold coating at the solder area, are homogeneous and free from contamination. Selective gold coating on a pin 12 is produced by masking a preselected region 60.

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Making Electrical Contact Pins

These gold-coated electrical contact pins are mounted in multilayer printed circuit boards. A pin 12 is mounted in composite board 10 having three multilayer board sections 14, 16, and 18. The latter are superimposed one upon another and mounted on a plurality of such contact pins. A pin 12 has an elongated base of electrical conductive material and heavy gold-plating on end portions 40 and 42 end thin gold-plating on center region 60. A pin 12 is soldered in board 10 through holes 20, 22, and 24 by solder fillets 30, 32, 34, and
36. The latter, due to the thin gold coating at the solder area, are homogeneous and free from contamination. Selective gold coating on a pin 12 is produced by masking a preselected region 60. Mask 50 is applied by feeding a pin 12 through apparatus in which a preferred printing ink, such as Matthews M-145, is applied to regions 60. The ink is normally maintained at a reduced temperature to prevent its contamination prior to use. Then, a masked pin 12 is subjected to a first gold-plating bath, receiving a first coating on end regions 40 and 42. Mask 50 is removed and each pin 12 is subjected to a second gold-plating bats which makes the gold coating thicker on the unmasked region than on region 60.

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