Browse Prior Art Database

Solder Ring Applicator Tool

IP.com Disclosure Number: IPCOM000090620D
Original Publication Date: 1969-Jun-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Buczak, RF: AUTHOR [+2]

Abstract

This apparatus is for applying solder ring forms from flux solder foil tape over electrical connector pins in ceramic substrates to form a pin-to-pattern connection at or during a solder reflow operation.

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Solder Ring Applicator Tool

This apparatus is for applying solder ring forms from flux solder foil tape over electrical connector pins in ceramic substrates to form a pin-to-pattern connection at or during a solder reflow operation.

The applicator tool comprises ring punching head 10. This is adapted to mate with substrate holder 11. Head 10 includes a plurality of cutting tubes 12. These are reciprocated in head 10 to cut through a strip of solder foil 13 and press foil rings 13A onto ejector pins 14 which are reciprocably mounted in holder 11. Pins 14 are positioned to be engaged interiorly of tubes 12 so as to deposit the foil 13 upon pins 14. Air is impressed upon tubes 12 so as to facilitate removal of rings 13A and deposit the same upon pins 14.

In application, head 10 is lowered into holder 11, this not as yet containing a substrate. Tubes 12 are brought downwardly cutting the foil 13 and impressing rings 13A over pins 14, circumscribing such pins which are in their elevated position. Then head 10 is elevated and pins 14 in holder 11 are moved downwardly leaving rings 13A deposited on the upper terminal surfaces, circumscribing the apertures through which pins 14 pass, drawing B. A substrate 15 is then inserted into holder 11, the connector pins 16 of the substrate passing through rings 13A previously formed. Tubes 12 in head 10 are elevated and a new strip of solder foil 13' is inserted and head 10 is again lowered. As tubes 12 descend cutting through the...