Browse Prior Art Database

Multilevel Ceramics

IP.com Disclosure Number: IPCOM000090630D
Original Publication Date: 1969-Jun-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Arndt, HL: AUTHOR [+2]

Abstract

The continuous handling method for processing and aligning multilevel ceramics utilizes a prepunched MYLAR* carrier strip 1. The latter 1 has prepunched pilot or registration holes 2 along with blanked squares 3 spaced along its length. Holes 2 are used for alignment on all operations. Green ceramic is prepared by doctoring a layer 4 on carrier 1, used for all related operations. Carrier 1 is not separated from green ceramic layer 4 as normally done in the usual methods. During the doctoring operation, green ceramic is extruded into openings 3 of carrier 1. Both are then processed on a thin belt while being dried to provide support for the green ceramic slurry. Holes 2 on the edge of carrier 1 are used to register all operations such as via hole punching, drawing C, screening drawing D, etc.

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Multilevel Ceramics

The continuous handling method for processing and aligning multilevel ceramics utilizes a prepunched MYLAR* carrier strip 1. The latter 1 has prepunched pilot or registration holes 2 along with blanked squares 3 spaced along its length. Holes 2 are used for alignment on all operations. Green ceramic is prepared by doctoring a layer 4 on carrier 1, used for all related operations. Carrier 1 is not separated from green ceramic layer 4 as normally done in the usual methods. During the doctoring operation, green ceramic is extruded into openings 3 of carrier 1. Both are then processed on a thin belt while being dried to provide support for the green ceramic slurry. Holes 2 on the edge of carrier 1 are used to register all operations such as via hole punching, drawing C, screening drawing D, etc. At the last process operation, the various layers are assembled and bonded together into a laminated stack 5, drawing E. The lamination stack is then simultaneously blanked and compressed, drawing F, into finished substrates 6 and further processed as required such as, e.g., firing.

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