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Simultaneous Etching of Screen and Electrode Patterns of Silk Screen Masks

IP.com Disclosure Number: IPCOM000090759D
Original Publication Date: 1969-Jun-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Kolbe, HF: AUTHOR

Abstract

For the manufacture of screen printings used for integrated circuits, two partial masks, an electrode and a screening mask, are required. Previously, such compound masks are manufactured using a number of procedural steps, such as etching the first partial mask from a plate-electrode pattern, etching the second partial mask from a plate-screening pattern, adjusting the two masks in relation to each other, and hard-soldering the two masks onto each other.

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Simultaneous Etching of Screen and Electrode Patterns of Silk Screen Masks

For the manufacture of screen printings used for integrated circuits, two partial masks, an electrode and a screening mask, are required. Previously, such compound masks are manufactured using a number of procedural steps, such as etching the first partial mask from a plate-electrode pattern, etching the second partial mask from a plate-screening pattern, adjusting the two masks in relation to each other, and hard-soldering the two masks onto each other.

In addition in another manufacturing process, two partial masks or the complete masks are produced by two concurrent etching processes. During these, the electrode pattern-partial mask and the screening pattern-partial mask are formed on the two sides of a joint master plate.

The former process, consisting of four steps entails critical adjusting. The soldering process, in addition, is cumbersome and intricate, since planar compound masks are difficult to produce. With the latter process, which only comprises one step, the simultaneous etching processes are particularly difficult to control.

To eliminate such difficulties, a compound plate be used, consisting of two individual plates which are connected to each other by a plastic or metal intermediate layer, by adhesion, soldering, or a rolling process. The material of the linking intermediate layer is chosen so that it is not attacked by the etchant used for the plates and that the etchin...