Browse Prior Art Database

Capacitor Heat Fins

IP.com Disclosure Number: IPCOM000090815D
Original Publication Date: 1969-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Betz, RJ: AUTHOR

Abstract

Cooling fins 10 for multilayer ceramic module 12 can be laminated to serve as capacitors. Fins 10 are brazed or soldered to module 12 and can be attached to either side of such module. If they are attached to the same side 10 as monolithic chips 14 are mounted on module 12, fins 10 protrude through the cap for module 12 to make contact with the cooling medium. If fins 10 are located on the opposite side of module 12 as chips 14, they do not interfere with the capping of such module. Fins 10 are laminated of layers of dielectric 16 and layers of metal 18 to provide the capacitive plates. They have metallized edges which are brazed to module 12 to provide a good thermal bond. A braze pad 20 arrangement provides voltage terminals for the fin capacitors.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Capacitor Heat Fins

Cooling fins 10 for multilayer ceramic module 12 can be laminated to serve as capacitors. Fins 10 are brazed or soldered to module 12 and can be attached to either side of such module. If they are attached to the same side 10 as monolithic chips 14 are mounted on module 12, fins 10 protrude through the cap for module 12 to make contact with the cooling medium. If fins 10 are located on the opposite side of module 12 as chips 14, they do not interfere with the capping of such module. Fins 10 are laminated of layers of dielectric 16 and layers of metal 18 to provide the capacitive plates. They have metallized edges which are brazed to module 12 to provide a good thermal bond. A braze pad 20 arrangement provides voltage terminals for the fin capacitors. Alternately, the voltage terminals can be incorporated into the thermal interconnection to metal
18.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]