Browse Prior Art Database

Miniature Contacting

IP.com Disclosure Number: IPCOM000090818D
Original Publication Date: 1969-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Cuevas, FC: AUTHOR [+2]

Abstract

This probe is to contact fine lines or tabs and enables the testing of the miniature circuits contained in printed circuit boards. The device uses piano wire 10 approximately .0048" in diameter as a miniature contact probe with a center-to-center spacing of .011". Rubber backing 11 provides spring pressure on the probes. By choosing rubbers of different duramens, a gram pressure from 40 to 500 grams can be achieved. Wire 10 provides not only a reliable contact but also a low resistance path from the contacted area to the test equipment. In assembly, wires 10 are inserted into holes and allowed to protrude approximately .030" through epoxy board 12. The holes serve to position wires 10 to the proper location on the circuit board being tested.

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Miniature Contacting

This probe is to contact fine lines or tabs and enables the testing of the miniature circuits contained in printed circuit boards. The device uses piano wire 10 approximately .0048" in diameter as a miniature contact probe with a center- to-center spacing of .011". Rubber backing 11 provides spring pressure on the probes. By choosing rubbers of different duramens, a gram pressure from 40 to 500 grams can be achieved. Wire 10 provides not only a reliable contact but also a low resistance path from the contacted area to the test equipment. In assembly, wires 10 are inserted into holes and allowed to protrude approximately
.030" through epoxy board 12. The holes serve to position wires 10 to the proper location on the circuit board being tested. On the other side of the board, wires 10 are bent at a 90 degree angle and routed to terminal lock 13. Over the bent area, rubber backing 11 is applied with a steel pressure plate 14 to hold the rubber in place and to provide the various tensions. The assembly has the advantage of providing for low contact loading in dense probe arrays.

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