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Filling Small Diameter Holes

IP.com Disclosure Number: IPCOM000090833D
Original Publication Date: 1969-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Missel, L: AUTHOR [+2]

Abstract

Holes in substrates which have a high length-to-diameter ratio can be filled by dipping the board into molten filler metal. The hole walls are first made wettable by plating them with highly wettable metal such as gold. Solder is an example of one of the many filler metals. Adhesion of the filler metal to external surfaces can be prevented if the substrate is made of, or coated with, nonwettable material.

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Filling Small Diameter Holes

Holes in substrates which have a high length-to-diameter ratio can be filled by dipping the board into molten filler metal. The hole walls are first made wettable by plating them with highly wettable metal such as gold. Solder is an example of one of the many filler metals. Adhesion of the filler metal to external surfaces can be prevented if the substrate is made of, or coated with, nonwettable material.

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