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Electroplated Thin Nickel Iron Films

IP.com Disclosure Number: IPCOM000090861D
Original Publication Date: 1969-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Jones, AD: AUTHOR [+2]

Abstract

Prior to electroplating a thin nickel-iron film on a vapor-deposited copper substrate, the substrate is immersed in an acidic palladium chloride solution. Thus a thin film of finely divided palladium is deposited on the substrate.

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Electroplated Thin Nickel Iron Films

Prior to electroplating a thin nickel-iron film on a vapor-deposited copper substrate, the substrate is immersed in an acidic palladium chloride solution. Thus a thin film of finely divided palladium is deposited on the substrate.

Formulation and operating conditions are

Palladium chloride - 1 gm.

Conc. Hcl - 20 mls

Water - To 1 Liter

Temperature - 25 degrees C

Agitation - slight

Immersion time - 20 minutes.

A 1000 angstroms thick nickel-iron film, electroplated on a substrate treated in this manner, has lower coercivity and angular dispersion than a similar film electroplated on an untreated copper substrate.

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