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Integrated Cooling and Contacting Arrangement

IP.com Disclosure Number: IPCOM000090875D
Original Publication Date: 1969-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

The assembly is arranged so that a desired coolant flow rate and temperature are maintained regardless of whether chip holder 10 is in position or not. Integrated circuit chip 12 is held onto holder 10 by a vacuum created within such holder. Holder 10 is easily movable into and out of the assembly, for changing the chip 12, because of flexible vapor seal 14. When holder 10 is in place, channel 16 is defined about it through which incoming coolant 18 passes to outer annulus 20 which is connected to coolant return 22. Coolant 18 is fed through distribution orifices 24 such that its flow is directed towards chip 12 where the heat is picked up. Electrical contactors 26 are a permanent part of the assembly and are arranged so that they contact chip 12 to be tested when holder 10 is in place.

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Integrated Cooling and Contacting Arrangement

The assembly is arranged so that a desired coolant flow rate and temperature are maintained regardless of whether chip holder 10 is in position or not. Integrated circuit chip 12 is held onto holder 10 by a vacuum created within such holder. Holder 10 is easily movable into and out of the assembly, for changing the chip 12, because of flexible vapor seal 14. When holder 10 is in place, channel 16 is defined about it through which incoming coolant 18 passes to outer annulus 20 which is connected to coolant return 22. Coolant 18 is fed through distribution orifices 24 such that its flow is directed towards chip 12 where the heat is picked up. Electrical contactors 26 are a permanent part of the assembly and are arranged so that they contact chip 12 to be tested when holder 10 is in place.

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