Browse Prior Art Database

Use of Centrifuge for Soldering Interconnections

IP.com Disclosure Number: IPCOM000090913D
Original Publication Date: 1969-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Speicher, CA: AUTHOR [+2]

Abstract

A more reliable soldered joint having less voids than other soldering methods is achieved by a process involving centrifugal force. The process uses the method involved in casting in which molten material carried in a crucible is rotated at high speed by a rotating arm or the like. Upon attaining a certain rotational velocity, an orifice in the crucible is opened to allow the molten material to flow into the mold. For soldering purposes, the material flow is directed against a printed circuit board in order to make soldered connections between the various pins and conductive patterns on it. An additional advantage of this soldering method is that the use of flux is minimized or, in some instances, is eliminated.

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Use of Centrifuge for Soldering Interconnections

A more reliable soldered joint having less voids than other soldering methods is achieved by a process involving centrifugal force. The process uses the method involved in casting in which molten material carried in a crucible is rotated at high speed by a rotating arm or the like. Upon attaining a certain rotational velocity, an orifice in the crucible is opened to allow the molten material to flow into the mold. For soldering purposes, the material flow is directed against a printed circuit board in order to make soldered connections between the various pins and conductive patterns on it. An additional advantage of this soldering method is that the use of flux is minimized or, in some instances, is eliminated.

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