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Browse Prior Art Database

Ring for Attaching a Component to Cooling Tank

IP.com Disclosure Number: IPCOM000090939D
Original Publication Date: 1969-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Patch, P: AUTHOR

Abstract

Float ring 10 is made of material which overcomes manufacturing tolerances when assembling and attaching heat sink studs 11 of component modules 12 to cooling tank 13. One method of attachment is by soldering. This entails rigid tolerance requirements, especially when mounting a plurality of modules in a single cooling tank. Float ring 10 is of material having both solder and cooling tank material compatibility, i.e., ring and tank materials have identical or substantially similar coefficient of expansion characteristics. In a preferred arrangement, the inside diameter of ring 10 is selected so as to provide a .005'' maximum clearance between ring 10 and studs 11.

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Ring for Attaching a Component to Cooling Tank

Float ring 10 is made of material which overcomes manufacturing tolerances when assembling and attaching heat sink studs 11 of component modules 12 to cooling tank 13. One method of attachment is by soldering. This entails rigid tolerance requirements, especially when mounting a plurality of modules in a single cooling tank. Float ring 10 is of material having both solder and cooling tank material compatibility, i.e., ring and tank materials have identical or substantially similar coefficient of expansion characteristics. In a preferred arrangement, the inside diameter of ring 10 is selected so as to provide a .005'' maximum clearance between ring 10 and studs 11. Ring 10 permits the use of relatively large holes in the tank mounting hole pattern while still enabling strong and reliable joints after the assembly is completed.

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